Description
Silicon Nitride Solutions has long been used in high-temperature applications. In particular, it was identified as one of the few monolithic ceramic materials capable of surviving the severe thermal shock and thermal gradients generated in hydrogen / oxygen rocket engines.
Silicon nitride is often used as an insulator and chemical barrier in manufacturing integrated circuits Some key properties of silicon nitride include: low density, superior thermal shock resistance, good oxidation resistance, mechanical fatigue resistance and high wear resistance.
Typical Applications Include: reciprocating engine components, jet propulsion components, orthopedic applications, thermocouple sheaths, arc welding nozzles, chemical insulators, electrical insulators, metal cutting tools, furnace fixtures, and bearing balls. Contact us for more info.
| Density, ρ g/cm3 ASTM C20 3.31 | g/cm3 | 3.31 |
| Water Absorption 0.0 | % @ room temperature (R.T.) | 0 |
| Hardness | Mohs | 9 |
| Hardness | Knoop (kg/mm2) | 2200 |
| Compressive Strength MPa @ R.T. | MPa @ R.T. | 689-2760 |
| Fracture Toughness, Kic | MPa x m1/2 | 5.0-8.0 |
| Max. Use Temperature (in air) | ºC | 1500 |
| Thermal Shock Resistance | ∆T (ºC) | 750 |
| Thermal Conductivity | W/m-K @ R.T. | 27 |
| Coefficient of Linear Thermal Expansion, αl | µm/m-ºC (~25ºC through ±1000ºC) | 3.4 |
| Dielectric Constan | 1 MHz @ R.T. | 7 |
| Dielectric Strength | kV/mm | 17.7 |
