Description
Silicon Nitride Solutions has long been used in high-temperature applications. In particular, it was identified as one of the few monolithic ceramic materials capable of surviving the severe thermal shock and thermal gradients generated in hydrogen / oxygen rocket engines.
Silicon nitride is often used as an insulator and chemical barrier in manufacturing integrated circuits Some key properties of silicon nitride include: low density, superior thermal shock resistance, good oxidation resistance, mechanical fatigue resistance and high wear resistance.
Typical Applications Include: reciprocating engine components, jet propulsion components, orthopedic applications, thermocouple sheaths, arc welding nozzles, chemical insulators, electrical insulators, metal cutting tools, furnace fixtures, and bearing balls. Contact us for more info.
Density, ρ g/cm3 ASTM C20 3.31 | g/cm3 | 3.31 |
Water Absorption 0.0 | % @ room temperature (R.T.) | 0 |
Hardness | Mohs | 9 |
Hardness | Knoop (kg/mm2) | 2200 |
Compressive Strength MPa @ R.T. | MPa @ R.T. | 689-2760 |
Fracture Toughness, Kic | MPa x m1/2 | 5.0-8.0 |
Max. Use Temperature (in air) | ºC | 1500 |
Thermal Shock Resistance | ∆T (ºC) | 750 |
Thermal Conductivity | W/m-K @ R.T. | 27 |
Coefficient of Linear Thermal Expansion, αl | µm/m-ºC (~25ºC through ±1000ºC) | 3.4 |
Dielectric Constan | 1 MHz @ R.T. | 7 |
Dielectric Strength | kV/mm | 17.7 |